Confirmations about the Oppo Find X6 Pro’s back camera design has appeared online. According to a Weibo post, the flagship’s smartphone camera has a factory-applied coating with four holes: the top hole is for the ToF LiDAR sensor, the two bottom circular holes are for the primary and ultra-wide-angle cameras, and the last rectangular hole is for the telephoto lens.
The leaks in fact confirm the photos from a few days ago, as well as the continuance of the partnership with Hasselblad, whose logo is more obvious than the one to the right of the telephoto lens and confirms the presence of Oppo’s MariSilicon X chip, the in-house created image processor (ISP).
The pre-launch design for Oppo Find X6 Pro, the top of the line model, has been expanded with the addition of a new component. Unlike the predecessor Find X5 Pro, which debuted in March of last year, the Find X6 Pro is yet to make its appearance. Although it is only a rumor for now, it may become official next month. Additional information should become available soon.
Gizchina News of the week
Oppo Find X6 Pro rumored specs
- 6.82″, Samsung E6 panel 2K resolution, maximum refresh rate 120 Hz, curved on all four sides screen
- Qualcomm Snapdragon 8 Gen 2 chip
- LPDDR5X RAM and UFS 4.0 storage
- Camera: proprietary ISP MariSilicon X, Hasselblad branding:
- primary rear: 50 MP Sony IMX890, optical stabilization
- ultra-wide angle rear: 50 MP Sony IMX890
- rear telephoto: 50MP Sony IMX890
- rear depth: ToF LiDAR sensor
- Front: 32MP Sony IMX709
- 5,000mAh battery
- 100W wired, 50W wireless charging
- In-display fingerprint reader, NFC, IP68 liquid and dust resistance.
Here are some technical details that we currently know of as a result of recent speculations. The smartphone is rumored to be available in two different configurations, one with MediaTek’s Dimensity 9200 CPU and the other with Qualcomm’s Snapdragon 8 Gen 2 chip, the same one used by Samsung for the Xiaomi 13 Pro and the OnePlus 11.