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Samsung achieves 3D stacking for 7nm EUV chip which saves power and take less space

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While the 7nm chipsets are the big reality of 2020, several companies are already moving to the next big thing – 5nm. Some companies like …

The post Samsung achieves 3D stacking for 7nm EUV chip which saves power and take less space appeared first on Gizchina.com.

Via: gizchina.com

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