Yesterday, Qualcomm announced the Snapdragon 888+ mobile platform as an overclocked version of the existing Snapdragon 888 chip. Apart from offering faster clocking speeds, the SD888+ is equipped with an improved AI Engine. Companies like Honor, ASUS, Motorola, Xiaomi, and Vivo are expected to launch phones fueled by the Snapdragon 888+ later this year. Today, popular tipster Digital Chat Station shared the key details of the upcoming Xiaomi’s SD888+ powered flagship.
Digital Chat Station’s Weibo post talks about the key features of an upcoming flagship phone featuring the SD888+ (mentioned as sm8450). The emoji of the bunny in the post is a good hint that he could be talking about Xiaomi’s next flagship.
According to the tipster, the new device will be sporting a punch-hole display with curved edges. He added that it will be equipped with a 200-megapixel lens as the primary camera. Previous reports have suggested that it could be featuring Samsung’s upcoming 200-megapixel sensor. It is unclear whether this phone belongs to the exiting Mi 11 series or some other series.
Other reports have claimed that the 200-megapixel ISOCELL sensor may measure 1/1.37-inch and it has 1.28-micron pixels. It could be equipped with 4-in-1 and 16-in-1 pixel binning technology, and it may allow users to record 16K videos.
Speaking of Xiaomi, a recent leak revealed the codenames of 13 upcoming Xiaomi phones. It has revealed that the company could be announcing as many as three phones with an in-screen selfie camera. Unfortunately, the leak has no information about its Snapdragon 888+ powered phone.
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